Thermal Vibration's Impacts on A GNSS Receiver in a Wireless Combo Chip

T-Y. Chiou, C-Y. Lo, S-Y. Huang, S-T. Wu, C-T. Weng

Abstract:	As the applications of a smart phone are booming, enormous user scenarios motivate us to consider a wireless combo chip which integrates GNSS, WiFi, Bluetooth, and FM together. To further reduce the cost, an idea of sharing a common clock by the systems of the combo chip is proposed. A difficulty originated from sharing a common clock is heat dispreading problem, which is defined as a thermal vibration. The thermal vibration will impair the clock signals. The purpose of this work is to analyze the thermal vibration’s impacts on the GNSS receiver in the wireless combo chip. This paper illustrates the problem; verifies the correlation between the impaired clock signals and the GNSS receiver sensitivity; proposes both hardware and software solutions, and demonstrates the effectiveness of the solutions by the final positioning performance of the GNSS receiver in the wireless combo chip.
Published in:	Proceedings of the 23rd International Technical Meeting of the Satellite Division of The Institute of Navigation (ION GNSS 2010) September 21 - 24, 2010 Oregon Convention Center, Portland, Oregon Portland, OR
Pages:	2952 - 2958
Cite this article:	Chiou, T-Y., Lo, C-Y., Huang, S-Y., Wu, S-T., Weng, C-T., "Thermal Vibration's Impacts on A GNSS Receiver in a Wireless Combo Chip," Proceedings of the 23rd International Technical Meeting of the Satellite Division of The Institute of Navigation (ION GNSS 2010), Portland, OR, September 2010, pp. 2952-2958.
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