Hybrid Methodology for Development of MEMS

Ryszard J. Pryputniewicz, Ryan T. Marinis, Adam R. Klempner and Peter Hefti

Abstract:	Recent advances in MEMS technology have led to development of a multitude of new devices. However applications of these devices are hampered by challenges posed by their integration and packaging. Current trend in micro/nanosystems is to produce ever smaller, lighter, and more capable devices in greater quantities and at a lower cost than ever before. In addition, the finished products have to operate at very low power and in very adverse conditions while assuring durable and reliable performance. Some of the new devices are being developed to function at high operational speeds, others to make accurate measurements of operating conditions in specific processes. Regardless of their application, the devices have to be packaged to facilitate their use. MEMS packaging, however, is application specific and, usually, has to be developed on a case by case basis. To facilitate advances of MEMS, educational programs have been introduced addressing all aspects in their development. This paper presents a hybrid methodology addressing various aspects in a development of MEMS including, but not limited to, design, analysis, fabrication, characterization, packaging, and testing. The presentation is illustrated with selected examples from development of specific MEMS. Keywords: MEMS technology, hybrid methodology, functional operating conditions, packaging, test and characterization.
Published in:	Proceedings of IEEE/ION PLANS 2006 April 25 - 27, 2006 Loews Coronado Resort Hotel San Diego, CA
Pages:	606 - 613
Cite this article:	Pryputniewicz, Ryszard J., Marinis, Ryan T., Klempner, Adam R., Hefti, Peter, "Hybrid Methodology for Development of MEMS," Proceedings of IEEE/ION PLANS 2006, San Diego, CA, April 2006, pp. 606-613. https://doi.org/10.1109/PLANS.2006.1650651
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