Patterned Polymer Bonding with 3-D capability for Microelectromechanical Systems (MEMS) Inertial Sensors

Eric J. Tuck, Gerald Tuck, Milan Buncick, Tracy Hudson and Tom Buckner

Abstract:	Complimentary to SOI technology, this paper details the cumulative results from two programs. The bonding technology which allows low temperature bonding of similar and dissimilar materials post patterning was developed under an Army SBIR. This process was applied to a multisensor on a chip Army component technology program. The purpose of the Army program was to investigate the use of controlled arrays of MEMS sensors to provide full dynamic performance ranges, improved harsh environment tolerances, and improved reliability for miniature sensing systems, focusing on inertial applications. Results of bonded multiplexed sensor arrays will be presented along with the benefits and difficulties in this type of process.
Published in:	Proceedings of IEEE/ION PLANS 2006 April 25 - 27, 2006 Loews Coronado Resort Hotel San Diego, CA
Pages:	599 - 605
Cite this article:	Tuck, Eric J., Tuck, Gerald, Buncick, Milan, Hudson, Tracy, Buckner, Tom, "Patterned Polymer Bonding with 3-D capability for Microelectromechanical Systems (MEMS) Inertial Sensors," Proceedings of IEEE/ION PLANS 2006, San Diego, CA, April 2006, pp. 599-605. https://doi.org/10.1109/PLANS.2006.1650650
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