Current capabilities of MEMS capacitive accelerometers in harsh environment

Jean-Michel Stauffer

Abstract:	One of the general trends of the MEMS sensors business is the utilization of the technology to satisfy harsh environment requirements (temperature, shock, vibration, environment, security). The conjunction of material (standard Silicon, SiC or SOI), with complex micromachining techniques and advanced assembly techniques are the key to provide robust sensors with a minimum concession on specification. The goal of this paper is to present progress on gun hard (>20’000g) and wide temperature range MEMS accelerometers (-120°C to +180°C). Concrete solutions and results (out of more than 500 tested products) will be presented and discussed in detail.
Published in:	Proceedings of IEEE/ION PLANS 2006 April 25 - 27, 2006 Loews Coronado Resort Hotel San Diego, CA
Pages:	23 - 25
Cite this article:	Stauffer, Jean-Michel, "Current capabilities of MEMS capacitive accelerometers in harsh environment," Proceedings of IEEE/ION PLANS 2006, San Diego, CA, April 2006, pp. 23-25. https://doi.org/10.1109/PLANS.2006.1650583
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