Silicon Micromachined IMU Integrated Electronics Development

James Sitomer, James Connelly, and Jacob Martin

Abstract:	Recent advances in the emerging silicon micromachining technology and electronics development are leading to dramatic changes in inertial system size and cost. This paper addresses the architecture of these systems and some of the major packaging developments that have to be addressed to achieve the minimum size and weight required for many applications. A concept is developed for packaging three micromechanical gyroscopes, three micromechanical accelerometers, and their support electronics in a volume of 1.5 cubic inches. The assembly consists of a stack of three chips-first MCM-Ds that are modified to accommodate the inertial instruments and numerous capacitors. Electrical interconnections for the stack are supplied by ceramic frames placed between and connected to the MCMs.
Published in:	Proceedings of the 49th Annual Meeting of The Institute of Navigation (1993) June 21 - 23, 1993 Royal Sonesta Hotel Cambridge, MA
Pages:	623 - 628
Cite this article:	Sitomer, James, Connelly, James, Martin, Jacob, "Silicon Micromachined IMU Integrated Electronics Development," Proceedings of the 49th Annual Meeting of The Institute of Navigation (1993), Cambridge, MA, June 1993, pp. 623-628.
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