Thermal Vibration's Impacts on a GPS Receiver in a Mobile Phone with Limited PCB Area and Placement

T-Y. Chiou, S-T. Wu, A-B. Chen

Abstract:	When designing a GNSS receiver for a mobile phone, it is crucial to consider the thermal impacts on the GNSS local clock. The local clock – usually a crystal oscillator (XO) or a temperature compensated crystal oscillator (TCXO) is sensitive to temperature changes. Components are suqeezed on a limited space (printed circuit board (PCB)) of a smart phone. Each electronic component is a heat source. Thus the local clock is easily impacted by the thermal vibrations from the sourrounded components. The thermal vibrations create excessive dynamic stress on the GNSS receiver and cause performance degradations in positioning. This paper illustrates the problem; verifies the correlation between the impaired clock signals and the GNSS receiver performance; proposes both hardware and software solutions, and demonstrates the effectiveness of the solutions by the final positioning performance of the GNSS receiver in a compact smart phone.
Published in:	Proceedings of the 25th International Technical Meeting of the Satellite Division of The Institute of Navigation (ION GNSS 2012) September 17 - 21, 2012 Nashville Convention Center, Nashville, Tennessee Nashville, TN
Pages:	3185 - 3191
Cite this article:	Chiou, T-Y., Wu, S-T., Chen, A-B., "Thermal Vibration's Impacts on a GPS Receiver in a Mobile Phone with Limited PCB Area and Placement," Proceedings of the 25th International Technical Meeting of the Satellite Division of The Institute of Navigation (ION GNSS 2012), Nashville, TN, September 2012, pp. 3185-3191.
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