Session A2: Advances in MEMS-based Inertial Sensors and Inertial Measurement Units (Invited Session)

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Date: Tuesday, April 21, 2020
Time: 1:45 p.m. - 5:30 p.m.
Location: Pavilion Ballroom East

Session Chairs:
Dr. Andrei Shkel
University of California, Irvine
Dr. Ronald Polcawich
DARPA

1. A Chip-based Brillouin Laser Gyroscope: Yu-Hung Lai, Myoung-Gyun Suh, Jiang Li, Yu-Kun Lu, Boqiang Shen, Qi-Fan Yang, Heming Wang, Ki Youl Yang, Kerry Vahala, Watson Laboratory of Applied Physics, California Institute of Technology
2. High-g Capacitive Accelerometer Arrays with Low Bias Instability: Gary K. Fedder, Vincent P.J. Chung, Metin G. Guney, Xiaoliang Li, Yi Chung Lin, Suresh Santhanam, Jeyanandh Paramesh, Tamal Mukherjee, Department of Electrical and Computer Engineering, Carnegie Mellon University
3. Micromachined Gyroscopes Made From 3D Molded Fused-Silica Shell Resonators: Khalil Najafi, Jae Yoong Cho, Sajal Singh, Tal Ngourney, Jonk-Kwan Woo, Behrooz Shiari, Ali Darvishian, Center for Wireless integrated MicroSensors and Systems (WIMS2), University of Michigan, Ann Arbor
4. State-of-the-Art in MEMS Coriolis Vibratory Gyroscopes with Multi-Degree-of-Freedom Architectures Designed for Dynamic Range, Robustness, and Sensitivity: Andrei M. Shkel, Cenk Acar, Chris Painter, Alex Trusov, Adam Schofield, Sergei Zotov, Igor Prikhodko, Brent Simon, Doruk Senkal, Alexandra Efimovskaya, Danmeng Wang, Sina Askari, Mohammad Asadian, University of California, Irvine
6. Environmentally-Robust High-Performance Silicon TIMU Chip: Farrokh Ayazi, Haoran Wen, Anosh Daruwalla, Pranav Gupta, Georgia Institute of Technology
7. Manufacturing Transition of High-Performance MEMS Gyroscopes: Jeffrey DeNatale, Teledyne Scientific & Imaging; Stephane Martel, Francois Dion and Jonathan Lachance, Teledyne DALSA Semiconductor, Inc.

Exhibitor Hosted Reception, 5:30 p.m. - 7:00 p.m.

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